The OSFP interconnect system has 60 contacts per port and supports 16 high speed pairs. With a 0.6mm contact pitch, 4 rows of contacts and a horizontal port pitch of 23.38mm, the OSFP footprint is optimized for signal integrity performance. The stacked connector is enhanced for low crosstalk and has ground commoning for resonance dampening. It is also designed for 1U applications. An integrated heat sink for optimal thermal performance is a feature of the design.
FEATURES AND BENEFITS